TraceTronic at the bonding career fair

Of 4th may 2010 TraceTronic will be present at the bonding at the technical university of Dresden and inform students about seminar papers, diploma thesis and possibilities for internships as well as opportunities to join our company.

TraceTronic will come up with information material about actual themes for seminars and diplomas, open internship and work student positions plus entries possibilities for alumni. The career networking fair is a ideal chance to get in touch for students and companies.

















News

18.06.2010
30th Conference „Elektronik im Kraftfahrzeug“  more

03.06.2010
New project of cooperation for the industry of building and agricultural machines  more

11.04.2010
TraceTronic at the bonding career fair  more

02.04.2010
TraceTronic at the 3rd innovation forum and 4th OUTPUT event  more